PCB Types: |
single layer printed boards
double layer printed boards
multilayer printed boards
flexible and flex-rigid printed boards
printed transformers
microwave boards
|
PCB Materials: |
FR-4
FR-4 (Hi Tg 170)
FR-5
CEM3
Rogers
Arlon
Taconic
|
Maximum number of layers | up to 32 |
Maximum PCB size |
580 * 700 mm (single layer PCB)
580 * 700 mm (double layer PCB)
|
Minimum PCB thickness |
0.2 mm (double layer PCB)
0.4 mm (four layer PCB)
0.6 mm (six layer PCB)
|
Maximum PCB thickness |
4.8 mm (double layer PCB)
4.8 mm(four layer PCB)
4.8 mm (six layer PCB)
|
Minimum PTH size |
0.1 mm metalized
0.2 mm non-metalized
|
Foil thickness | 9, 12, 18, 35, 50, 70, 100, 150, 200 micrometers |
Possible colors | green, yellow, black, blue, red, white, transparent |
Peelable mask | Possible |
Min track width | 0,05 mm |
Min. line width of the mask | 0.1 mm |
Min. gap between the edge of the mask and the edge of the board | 0.038 mm |
Available colors | green, white, red, blue, brown, purple, yellow, black |
Min width of the marking line | 0.1 mm |
Cover Options |
HASL – from 5 micrometers
Nickel – from 2.5 micrometers
ENIG – from 0.025 to 0.05 micrometers
Flash gold – from 0.025 to 0.075 micrometers
Entek (OSP) – from 0.25 to 0.5 micrometers
Graphite – from 10 to 25 micrometers
Gilding edge connector – to 1.27 micrometers
Immersion tin – 1 micrometer
|
Final finish |
Pb-free HASL
Cu + OSP (Entek)
Electrolytic nickel/immersion gold
Immersion silver
Immersion tin
|
Basic materials used for PCB manufacturing meet the requirements of Pb-free technology: |
Glass point is 150° C and higher
Brominated epoxides are substituted with phosphorus containing materials
|
- Flying probes
- Contact pads
- Impedance
- Differential impedance
- Gerber
- CAM350
- PCAD 4.5/8.Х/200х
- OrCAD 9.x/10.х
- Allegro 14.x/15.х
- Mentor Graphics
- PADS PowerPCB
- Prototypes and small series: 10 working days
- Mass production: 25-30 working days